Liu, Xingsheng. author.; Zhao, Wei. author.; Xiong, Lingling. author.; Liu, Hui. author.; SpringerLink (Online service)
(New York, NY : Springer New York : Imprint: Springer, 2015., 2015)
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, ...